Microelectronics and Advanced Packaging Technologies Roadmap 2.0
The Semiconductor Research Corporation has released its Microelectronics and Advanced Packaging Technologies (MAPT) Roadmap 2.0.
This comprehensive update to the industry’s first 3D semiconductor roadmap includes contributions from over 370 experts from 132 organizations, with updated content and a new chapter on digital twins and their applications.
The roadmap was funded by the U.S. Department of Commerce’s NIST and supports the CHIPS Act by providing a strategic framework for the semiconductor supply chain.
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Author's summary: Updated roadmap for microelectronics technologies.